Table of Contents

Preface, Part 1: Introduction and Recent Developments Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives, Part 2: Mechanical Durability and Reliability Aspects Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications Y. C. Lin and X. Chen Drop Test Performance of Isotropic Electrically Conductive Adhesives, Part 3: Characterization and Properties Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives M. Teo Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure

About the Author

Gomatam, Rajesh; Mittal, Kash L.