Table of Contents

Thermodynamics and phase diagrams of lead-free solder materials.- Phase diagrams of Pb-free solders and their related materials systems.- The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints.- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications.- Rare-earth additions to lead-free electronic solders.- Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders.- Sn-Zn low temperature solder.- Composite lead-free electronic solders.- Processing and material issues related to lead-free soldering.- Interfacial reaction issues for lead-free electronic solders.- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys.- Deformation behavior of tin and some tin alloys.- Mechanical fatigue of Sn-rich Pb-free solder alloys.- Life expectancies of Pb-free SAC solder interconnects in electronic hardware.- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments.- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages.- Electromigration issues in lead-free solder joints.- Stress analysis of spontaneous Sn whisker growth.- Sn-whiskers: truths and myths.- Tin pest issues in lead-free electronic solders.- Issues related to the implementation of Pb-free electronic solders in consumer electronics.- Impact of the ROHS directive on high-performance electronic systems.- Impact of the ROHS Directive on high-performance electronic systems.

Reviews

From the reviews: "The main part of the text is devoted to soldering materials with all the most common alloys illustrated and supported with mechanical data and phase diagrams. … there is a lot of real value on the informative to research and process engineers who want to go deeper into the subject." (Bob Willis, Electronics Production World, August, 2007)