Table of Contents

An Overview of Electronic Devices and Their Reliability. Electronic Devices: How They Operate and Are Fabricated. Defects, Contaminants, and Yield. The Mathematics of Failure and Reliability. Mass Transport-Induced Failure. Electronic Charge-Induced Damage. Environmental Damage to Electronic Products. Packaging Materials, Processes and Stresses. Degradation of Contacts and Package Interconnections. Degradation and Failure of Electro-Optical Materials and Devices. Characterization and Failure Analysis of Materials and Devices. Future Directions and Reliability Issues.

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Key Features
* Discusses reliability and failure on both the chip and packaging levels
* Handles the role of defects in yield and reliability
* Includes a tutorial chapter on the mathematics of reliability
* Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints
* Considers defect detection methods and failure analysis techniques

About the Author

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.