SEMICONDUCTOR PACKAGES: History and Background. Package Form Factors and Families. Surface-Mount Technology. Other Packaging Needs. PACKAGE RELIABILITY: Reliability Testing. MATERIALS USED IN SEMICONDUCTOR PACKAGING: Polymers. Metals. Ceramics and Glasses. THE FUTURE: Trends and Challenges. Light-Emitting Diodes. Appendices. Index.
Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.
Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.
Meticulously written and organized ... this book has everything
needed to develop a complete understanding of semiconductor
packaging, particularly how materials interact with one another.
... this book is easy to read and, more importantly, easy to
understand ... Particularly valuable are the appendices from the
chapter describing analytical tools, what they are and how they are
used and the chapter on destructive tools and tests. ... whether an
experienced engineer involved in electronic packaging or a novice,
you need to make sure that this volume is a part of your technical
library.
—Dan Beaulieu, D.B. Management Group, in I-Connect007, December
2011This book provides a complete and systematic discussion of key
materials used in electronic packages. Unlike most of its
competitors which are composed by several contributors, this book
is written by two authors who are well-respected veterans in the
electronic package industry. Therefore, consistency and easy to
follow for new engineers and students will be the most
distinguishing features for this book.
—Kevin K.L. Chen, Qualcomm Atheros, San Jose, California, USA This
book gives a good general overview of materials used in the making
of semiconductor packages. The text covers both individual material
types and their performance requirements in the end product. Also
discussed are the historical background, purpose, key material
properties, various material interactions, reliability
requirements, and future trends. The book is easy to read and would
serve as an excellent introduction to the subject for a student or
engineer unfamiliar with the topic. It would also serve as a handy
reference guide for a basic understanding of semiconductor
packaging materials, as well of semiconductor packaging itself.
—Zemo Yang, Ambarella Corp, Santa Clara, California, USAMaterials
technology is enabling the rapid development of new and advanced
semiconductor packaging form factors. Knowledge of how material
interactions impact package reliability and performance is ever
more critical to the semiconductor industry, so both students and
engineers need a resource to turn to in understanding material
technology issues and trade-offs. This book serves as such a
resource and reference guide to the world of semiconductor
packaging materials.
—Daniel P. Tracy, SEMI, San Jose, California, USAA great book for
someone who quickly wishes to get up to speed in 1st level of
semiconductor packaging.
—Jack Belani, Vice President, Marketing and Sales, Contact
Materials Division, Heraeus Materials Technology LLC
|
Ask a Question About this Product More... |
|
