Table of Contents

1. Introduction – 3D integration and near-field coupling; 2. ThruChip interface – a wireless chip interface; 3. Transmission line coupler – a wireless module connector; 4. The future of computing – 3D SRAM for neural network, eBrain.

Promotional Information

Synthesising fifteen years of research, this text provides a comprehensive treatment of two major technologies for wireless chip and module interface design.

About the Author

Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE. Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.